SI643HU
特点
● Tg 245℃(DMA)● 低的XY轴/Z轴CTE及更高模量
● 优异的钻孔加工性
● 无卤素环保材料，适合无铅制程，符合RoHS/WEEE
应用领域
● TF, UDP, SIM卡等
● LED RGB显示● 内嵌式存储
● RF/摄像头/指纹识别模组
- 产品性能
- 产品证书
- 资料下载
| Items | Condition | Unit | SI643HU | SI643U |
|---|---|---|---|---|
| Tg | DMA | ℃ | 245 | 230 |
| Td | 5% wt. loss |
℃ |
409 | 400 |
| CTE (Z-axis) | x/y-axis(α1) | ppm/℃ | ~10 | 12-13 |
|
(40-260℃), z-axis(α1/α2)1) |
ppm/℃ |
25/143 | 27/150 | |
|
Dielectric Constant (1GHz) |
- | - | 4.5 | 4.4 |
|
Dissipation Factor (1GHz) |
- | - | 0.007 | 0.007 |
|
Solder Dipping |
288 ℃ |
min |
>30 | >30 |
|
Peel Strength 1) |
1/3 Oz, VLP Copper Foil | N/mm | 0.73 | 0.8 |
|
Young’s modulus |
50℃ |
GPa | 25 | 22 |
| 200℃ | GPa | 22 | 15 | |
|
Flexural modulus1) |
50℃ | GPa | 28 | 26 |
| 200℃ | GPa | 18 | 16 | |
|
Water Absorption1) |
A | % | 0.17 | 0.2 |
| 85℃/85%Rh, 168Hr | % | 0.54 | 0.63 | |
|
Flammability |
UL-94 |
Rating |
V-0 |
V-0 |
|
Thermal Conductivity |
- | W/(m·K) | 0.61 | 0.58 |
Remarks:
All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.